Printed circuit board, power semiconductor module arrangement comprising a printed circuit board, and method for assembling the same | Patent Publication Number 20230238314

US 20230238314 A1
Patent NumberUS 12002740 B2
Application Number18101198
Filled DateJan 25, 2023
Priority DateJan 25, 2023
Publication DateJul 27, 2023
Original AssigneeInfineon Technologies Ag
Current AssigneeInfineon Technologies Ag
Inventor/ApplicantsGuido Bonig
Sebastian Michalski
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