Printed circuit board, power semiconductor module arrangement comprising a printed circuit board, and method for assembling the same | Patent Number 12002740

US 12002740 B2
Application Number18101198
Publication NumberUS 20230238314 A1
Pendency1 year, 4 months, 11 days
Filled DateJan 25, 2023
Priority DateJan 25, 2023
Publication DateJul 27, 2023
Expiration DateJan 24, 2043
Inventor/ApplicantsGuido Bonig
Sebastian Michalski
ExaminesNGO, HUNG V
Art Unit2841
Technology Center2800
Assignments
Infineon Technologies Ag
Current
Infineon Technologies Ag
Original
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