Printed circuit board, power semiconductor module arrangement comprising a printed circuit board, and method for assembling the same | Patent Application Number 18101198

18101198
Not Appealed
Patent NumberUS 12002740 B2
Publication NumberUS 20230238314 A1
Filled DateJan 25, 2023
Priority DateJan 25, 2023
Inventor/ApplicantsGuido Bonig
Sebastian Michalski
ExaminesNGO, HUNG V
Art Unit2841
Technology Center2800
Assignments
Infineon Technologies Ag
Current
Infineon Technologies Ag
Original
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