Anchor vias for improved backside metal adhesion to semiconductor substrate | Patent Publication Number 20140252651

US 20140252651 A1
Patent NumberUS 09245826 B2
Application Number14165377
Filled DateJan 27, 2014
Priority DateMar 11, 2013
Publication DateSep 11, 2014
Original AssigneeNewport Fab Llc
Inventor/ApplicantsScott B. Stetson
Hadi Jebory
David J. Howard
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