Anchor vias for improved backside metal adhesion to semiconductor substrate | Patent Number 09245826

US 09245826 B2
Application Number14165377
Publication NumberUS 20140252651 A1
Pendency1 year, 12 months, 4 days
Filled DateJan 27, 2014
Priority DateMar 11, 2013
Publication DateSep 11, 2014
Expiration DateMar 10, 2033
Inventor/ApplicantsScott B. Stetson
Hadi Jebory
David J. Howard
ExaminesCLARK, JASMINE JHIHAN B
Art Unit2816
Technology Center2800
Law Firm
You must be logged in to view
Login
Attorneys
Subscription-Only
View Concierge Program
Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.