Anchor vias for improved backside metal adhesion to semiconductor substrate | Patent Application Number 14165377
14165377
Not Appealed
Patent NumberUS 09245826 B2
Publication NumberUS 20140252651 A1
Filled DateJan 27, 2014
Priority DateMar 11, 2013
Inventor/ApplicantsScott B. Stetson
Hadi Jebory
David J. Howard
Hadi Jebory
David J. Howard
ExaminesCLARK, JASMINE JHIHAN B
Art Unit2816
Technology Center2800
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