Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects | Patent Publication Number 20110049716
US 20110049716 A1Publication DateMar 3, 2011
Original AssigneeInternational Business Machines
Current AssigneeGlobalfoundries
Inventor/ApplicantsChih-Chao Yang
Chao-Kun Hu
Chao-Kun Hu
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