Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects | Patent Number 08039966

US 08039966 B2
Application Number12553265
Publication NumberUS 20110049716 A1
Pendency2 years, 1 month, 15 days
Filled DateSep 3, 2009
Priority DateSep 3, 2009
Publication DateMar 3, 2011
Expiration DateSep 2, 2029
Inventor/ApplicantsChih-Chao Yang
Chao-Kun Hu
ExaminesABDELAZIEZ, YASSER A
Art Unit2812
Technology Center2800
Assignments
Globalfoundries
Current
International Business Machines
Original
Law Firm
You must be logged in to view
Login
Attorneys
Subscription-Only
View Concierge Program
Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.
Check our Latest ReportPurchase IP Module

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.