Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects | Patent Application Number 12553265

12553265
Not Appealed
Patent NumberUS 08039966 B2
Publication NumberUS 20110049716 A1
Filled DateSep 3, 2009
Priority DateSep 3, 2009
Inventor/ApplicantsChao-Kun Hu
Chih-Chao Yang
ExaminesABDELAZIEZ, YASSER A
Art Unit2812
Technology Center2800
Assignments
Globalfoundries
Current
International Business Machines
Original
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