Cobalt nitride layers for copper interconnects and methods for forming them | Patent Publication Number 20080254232

US 20080254232 A1
Patent NumberUS 07973189 B2
Application Number12100319
Filled DateApr 9, 2008
Priority DateApr 9, 2007
Publication DateOct 16, 2008
Original AssigneeHarvard College
Current AssigneeHarvard College
Inventor/ApplicantsHoon Kim
Harish Bhandari
Roy Gerald Gordon
Harish BHANDARI
Roy G. GORDON
Hoon KIM
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