Cobalt nitride layers for copper interconnects and methods for forming them | Patent Application Number 12100319

12100319
Not Appealed
Patent NumberUS 07973189 B2
Publication NumberUS 20080254232 A1
Filled DateApr 9, 2008
Priority DateApr 9, 2007
Inventor/ApplicantsHarish Bhandari
Hoon Kim
Harish BHANDARI
Hoon KIM
Roy G. GORDON
Roy Gerald Gordon
ExaminesNAZARIO GONZALEZ, PORFIRIO
Art Unit1621
Technology Center1600
Assignments
Harvard College
Current
Harvard College
Original
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