Cobalt nitride layers for copper interconnects and methods for forming them | Patent Number 07973189

US 07973189 B2
Application Number12100319
Publication NumberUS 20080254232 A1
Pendency3 years, 2 months, 27 days
Filled DateApr 9, 2008
Priority DateApr 9, 2007
Publication DateOct 16, 2008
Expiration DateApr 8, 2027
Inventor/ApplicantsHoon Kim
Harish Bhandari
Roy Gerald Gordon
Harish BHANDARI
Roy G. GORDON
Hoon KIM
ExaminesNAZARIO GONZALEZ, PORFIRIO
Art Unit1621
Technology Center1600
Assignments
Harvard College
Current
Harvard College
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