Method and apparatus for providing structural support for interconnect pad while allowing signal conductance | Patent Publication Number 20070210442

US 20070210442 A1
Patent NumberUS 07626276 B2
Application Number11750048
Filled DateMay 17, 2007
Priority DateJan 11, 2005
Publication DateSep 13, 2007
Original AssigneeNxp Semiconductors
Current AssigneeMorgan Stanley Senior Funding Inc.
Inventor/ApplicantsCheng Choi Yong
Susan H. Downey
Kevin J. Hess
James W. Miller
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