Method and apparatus for providing structural support for interconnect pad while allowing signal conductance | Patent Number 07626276

US 07626276 B2
Application Number11750048
Publication NumberUS 20070210442 A1
Pendency2 years, 6 months, 19 days
Filled DateMay 17, 2007
Priority DateJan 11, 2005
Publication DateSep 13, 2007
Expiration DateJan 10, 2025
Inventor/ApplicantsJames W. Miller
Cheng Choi Yong
Kevin J. Hess
Susan H. Downey
ExaminesZARNEKE, DAVID A
Art Unit2891
Technology Center2800
Assignments
Morgan Stanley Senior Funding Inc.
Current
Freescale Semiconductor Inc.Nxp Semiconductors
Original
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