Method and apparatus for providing structural support for interconnect pad while allowing signal conductance | Patent Application Number 11750048

11750048
Not Appealed
Patent NumberUS 07626276 B2
Publication NumberUS 20070210442 A1
Filled DateMay 17, 2007
Priority DateJan 11, 2005
Inventor/ApplicantsCheng Choi Yong
Susan H. Downey
Kevin J. Hess
James W. Miller
ExaminesZARNEKE, DAVID A
Art Unit2891
Technology Center2800
Assignments
Morgan Stanley Senior Funding Inc.
Current
Freescale Semiconductor Inc.Nxp Semiconductors
Original
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