Through silicon via structure, method of formation, and integration in semiconductor substrate | Patent Application Number 13415744
13415744
Not Appealed
Patent NumberUS 09147609 B2
Publication NumberUS 20130087893 A1
Filled DateMar 8, 2012
Priority DateOct 7, 2011
Inventor/ApplicantsDavid J. Howard
Hadi Jebory
Hadi Jebory
ExaminesBACHNER, ROBERT G
Art Unit2898
Technology Center2800
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