Substrate processing system and transfer method | Patent Publication Number 20230215753
US 20230215753 A1Patent NumberUS 12165893 B2
Application Number18182716
Filled DateMar 13, 2023
Priority DateFeb 2, 2022
Publication DateJul 6, 2023
Original AssigneeTokyo Electron Limited
Current AssigneeTokyo Electron Limited
Inventor/ApplicantsMasatomo Kita
Norihiko AMIKURA
Shin MATSUURA
Toshiyuki MAKABE
Gyeong min Park
Shin Matsuura
Nobutaka Sasaki
Nobutaka SASAKI
Toshiyuki Makabe
Masatomo KITA
Gyeong min PARK
Norihiko Amikura
Norihiko AMIKURA
Shin MATSUURA
Toshiyuki MAKABE
Gyeong min Park
Shin Matsuura
Nobutaka Sasaki
Nobutaka SASAKI
Toshiyuki Makabe
Masatomo KITA
Gyeong min PARK
Norihiko Amikura
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