Substrate processing system and transfer method | Patent Number 12165893

US 12165893 B2
Application Number18182716
Publication NumberUS 20230215753 A1
Pendency1 year, 9 months, 3 days
Filled DateMar 13, 2023
Priority DateFeb 2, 2022
Publication DateJul 6, 2023
Expiration DateFeb 1, 2042
Inventor/ApplicantsMasatomo Kita
Norihiko AMIKURA
Shin MATSUURA
Toshiyuki MAKABE
Gyeong min Park
Shin Matsuura
Nobutaka Sasaki
Nobutaka SASAKI
Toshiyuki Makabe
Masatomo KITA
Gyeong min PARK
Norihiko Amikura
ExaminesBERRY JR, WILLIE WENDELL
Art Unit3652
Technology Center3600
Assignments
Tokyo Electron Limited
Current
Tokyo Electron Limited
Original
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