SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD OF FABRICATING THEREOF | Patent Publication Number 20230067799
US 20230067799 A1Publication DateMar 2, 2023
Original Assignee
Current AssigneeTaiwan Semiconductor Manufacturing Company
Inventor/ApplicantsCheng-Chi CHUANG
Chih-Hao WANG
Sheng-Tsung WANG
Kuan-Lun CHENG
Chia-Hao CHANG
Lin-Yu HUANG
Chih-Hao WANG
Sheng-Tsung WANG
Kuan-Lun CHENG
Chia-Hao CHANG
Lin-Yu HUANG
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