Semiconductor package | Patent Publication Number 20220406746

US 20220406746 A1

Patent NumberUS 12166007 B2

Application Number17681096

Filled DateFeb 25, 2022

Priority DateFeb 25, 2022

Publication DateDec 22, 2022

Original AssigneeSamsung Electronics

Current AssigneeSamsung Electronics

Inventor/ApplicantsByeonguk Jeon

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