Semiconductor package | Patent Number 12166007

US 12166007 B2
Application Number17681096
Publication NumberUS 20220406746 A1
Pendency2 years, 9 months, 19 days
Filled DateFeb 25, 2022
Priority DateFeb 25, 2022
Publication DateDec 22, 2022
Expiration DateFeb 24, 2042
Inventor/ApplicantsByeonguk Jeon
Examines-
Art Unit0
Technology Center0
Assignments
Samsung Electronics
Current
Samsung Electronics
Original
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