Methods for etching a material layer for semiconductor applications | Patent Publication Number 20220399205
US 20220399205 A1Patent NumberUS 12165877 B2
Application Number17770019
Filled DateDec 23, 2019
Priority DateDec 23, 2019
Publication DateDec 15, 2022
Original AssigneeApplied Materials Inc.
Current AssigneeApplied Materials Israel
Inventor/ApplicantsJiao YANG
Jon C. FARR
Alfredo GRANADOS
Ruizhe Ren
Zhigang WANG
Heng WANG
Ruizhe REN
Jon C. Farr
Heng Wang
Jiao Yang
Zhigang Wang
Alfredo Granados
Jon C. FARR
Alfredo GRANADOS
Ruizhe Ren
Zhigang WANG
Heng WANG
Ruizhe REN
Jon C. Farr
Heng Wang
Jiao Yang
Zhigang Wang
Alfredo Granados
Empower your practice with Patexia Publication Prosecution IP Module.
Get access to our exclusive rankings and unlock powerful data.
Looking for a Publication Attorney?
Get in touch with our team or create your account to start exploring a
network of over 120K attorneys.