Methods for etching a material layer for semiconductor applications | Patent Application Number 17770019

17770019
Not Appealed
Patent NumberUS 12165877 B2
Publication NumberUS 20220399205 A1
Filled DateDec 23, 2019
Priority DateDec 23, 2019
Inventor/ApplicantsJiao YANG
Jon C. FARR
Alfredo GRANADOS
Ruizhe Ren
Zhigang WANG
Heng WANG
Ruizhe REN
Jon C. Farr
Heng Wang
Jiao Yang
Zhigang Wang
Alfredo Granados
ExaminesAHMED, SHAMIM
Art Unit1713
Technology Center1700
Assignments
Applied Materials Israel
Current
Applied Materials IsraelApplied Materials Inc.
Original
Law Firm
You must be logged in to view
Login
Attorneys
Module Locked
Patent Claims data is locked.
Login To View
Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.
Check our Latest ReportPurchase IP Module

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.