Semiconductor package, and a package on package type semiconductor package having the same | Patent Publication Number 20220359469

US 20220359469 A1
Patent NumberUS 12166013 B2
Application Number17578621
Filled DateJan 19, 2022
Priority DateJan 19, 2022
Publication DateNov 10, 2022
Original AssigneeSamsung Electronics
Current AssigneeSamsung Electronics
Inventor/ApplicantsYounglyong KIM
Myungkee CHUNG
Hyunsoo CHUNG
Myungkee Chung
Hyunsoo Chung
Younglyong Kim
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