Semiconductor package, and a package on package type semiconductor package having the same | Patent Application Number 17578621

17578621
Not Appealed
Patent NumberUS 12166013 B2
Publication NumberUS 20220359469 A1
Filled DateJan 19, 2022
Priority DateJan 19, 2022
Inventor/ApplicantsYounglyong KIM
Myungkee CHUNG
Hyunsoo CHUNG
Myungkee Chung
Hyunsoo Chung
Younglyong Kim
ExaminesCLARK, JASMINE JHIHAN B
Art Unit2816
Technology Center2800
Assignments
Samsung Electronics
Current
Samsung Electronics
Original
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