DUAL CRITICAL DIMENSION PATTERNING | Patent Publication Number 20220328304
US 20220328304 A1Publication DateOct 13, 2022
Original Assignee
Current AssigneeTaiwan Semiconductor Manufacturing Company
Inventor/ApplicantsKuo-Chang Kau
Chia-Chu Liu
Hua-Tai Lin
Wen-Yun Wang
Chia-Chu Liu
Hua-Tai Lin
Wen-Yun Wang
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