Molded die slivers with exposed front and back surfaces | Patent Publication Number 20200180314

US 20200180314 A1

Patent NumberUS 11292257 B2

Application Number16704122

Filled DateDec 5, 2019

Priority DateMar 18, 2014

Publication DateJun 11, 2020

Original AssigneeHewlett Packard Enterprise

Current AssigneeHewlett Packard Enterprise

Inventor/ApplicantsChien-Hua Chen
Michael W Cumbie

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