Molded die slivers with exposed front and back surfaces | Patent Publication Number 20200180314
US 20200180314 A1Patent NumberUS 11292257 B2
Application Number16704122
Filled DateDec 5, 2019
Priority DateMar 18, 2014
Publication DateJun 11, 2020
Original AssigneeHewlett Packard Enterprise
Current AssigneeHewlett Packard Enterprise
Inventor/ApplicantsChien-Hua Chen
Michael W Cumbie
Michael W Cumbie
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