Molded die slivers with exposed front and back surfaces | Patent Application Number 16704122

16704122
Not Appealed
Patent NumberUS 11292257 B2
Publication NumberUS 20200180314 A1
Filled DateDec 5, 2019
Priority DateMar 18, 2014
Inventor/ApplicantsMichael W Cumbie
Chien-Hua Chen
ExaminesUHLENHAKE, JASON S
Art Unit2853
Technology Center2800
Assignments
Hewlett Packard Enterprise
Current
Hewlett Packard Enterprise
Original
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