Through array contact (TAC) for three-dimensional memory devices | Patent Publication Number 20190341399
US 20190341399 A1Patent NumberUS 10658378 B2
Application Number16047182
Filled DateJul 27, 2018
Priority DateMay 3, 2018
Publication DateNov 7, 2019
Original AssigneeYangtze Memory Technologies Co. Ltd.
Current AssigneeYangtze Memory Technologies Co. Ltd.
Inventor/ApplicantsYu Ting ZHOU
ZhiWu TANG
Enbo WANG
Qianbing Xu
Qian TAO
Xiaowang DAI
Jian Hua SUN
ZhiWu Tang
Sha Sha Liu
Mei Lan Guo
Qinxiang Wei
Xiaowang Dai
Yu Ting Zhou
Li Hong Xiao
Zhao Hui Tang
Zhenyu Lu
Sha Sha LIU
Yushi HU
Qinxiang WEI
Qianbing XU
Zhao Hui TANG
Qian Tao
Yushi Hu
Jian Hua Sun
Zhenyu LU
Li Hong XIAO
Enbo Wang
Mei Lan GUO
ZhiWu TANG
Enbo WANG
Qianbing Xu
Qian TAO
Xiaowang DAI
Jian Hua SUN
ZhiWu Tang
Sha Sha Liu
Mei Lan Guo
Qinxiang Wei
Xiaowang Dai
Yu Ting Zhou
Li Hong Xiao
Zhao Hui Tang
Zhenyu Lu
Sha Sha LIU
Yushi HU
Qinxiang WEI
Qianbing XU
Zhao Hui TANG
Qian Tao
Yushi Hu
Jian Hua Sun
Zhenyu LU
Li Hong XIAO
Enbo Wang
Mei Lan GUO
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