Method of room temperature covalent bonding | Patent Publication Number 20060216904

US 20060216904 A1

Patent NumberUS 07335996 B2

Application Number11442394

Filled DateMay 30, 2006

Priority DateMay 19, 2003

Publication DateSep 28, 2006

Original AssigneeZiptronix

Current AssigneeBank Of America Corporation

Inventor/ApplicantsQin-Yi Tong

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