Method of room temperature covalent bonding | Patent Number 07335996

US 07335996 B2
Application Number11442394
Publication NumberUS 20060216904 A1
Pendency1 year, 9 months, 2 days
Filled DateMay 30, 2006
Priority DateMay 19, 2003
Publication DateSep 28, 2006
Expiration DateMay 19, 2023
Inventor/ApplicantsQin-Yi Tong
ExaminesVU, DAVID
Art Unit2818
Technology Center2800
Assignments
Bank Of America Corporation
Current
Ziptronix
Original
Law Firm
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