Chemical mechanical polishing apparatus and method | Patent Number 10967478

US 10967478 B2
Application Number16031899
Publication NumberUS 20190099854 A1
Pendency2 years, 9 months, 1 day
Filled DateJul 10, 2018
Priority DateSep 29, 2017
Publication DateApr 4, 2019
Expiration DateSep 28, 2037
Inventor/ApplicantsShich-Chang Suen
Liang-Guang Chen
Kei-Wei Chen
ExaminesNGUYEN, GEORGE BINH MINH
Art Unit3723
Technology Center3700
Assignments
Taiwan Semiconductor Manufacturing Company
Current
Taiwan Semiconductor Manufacturing Company
Original
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