Chemical mechanical polishing apparatus and method | Patent Application Number 16031899

16031899
Not Appealed
Patent NumberUS 10967478 B2
Publication NumberUS 20190099854 A1
Filled DateJul 10, 2018
Priority DateSep 29, 2017
Inventor/ApplicantsShich-Chang Suen
Liang-Guang Chen
Kei-Wei Chen
ExaminesNGUYEN, GEORGE BINH MINH
Art Unit3723
Technology Center3700
Assignments
Taiwan Semiconductor Manufacturing Company
Current
Taiwan Semiconductor Manufacturing Company
Original
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