Reinforced bond pad | Patent Number 06960836

US 06960836 B2
Application Number10675260
Publication NumberUS 20050067709 A1
Pendency2 years, 1 month, 3 days
Filled DateSep 30, 2003
Priority DateSep 30, 2003
Publication DateMar 31, 2005
Expiration DateSep 30, 2023
Inventor/ApplicantsJohn William Osenbach
Sailesh Mansinh Merchant
Mark Adam Bachman
Daniel Patrick Chesire
Kurt George Steiner
ExaminesNGUYEN, THINH T
Art Unit2818
Technology Center2800
Assignments
Hilco Patent Acquisition 55 Llc
Current
Bell Semiconductor Llc
Current
Bellnorthern Research
Current
Agere Systems BroadcomBroadcom
Original
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