Reinforced bond pad | Patent Application Number 10675260

10675260
Not Appealed
Patent NumberUS 06960836 B2
Publication NumberUS 20050067709 A1
Filled DateSep 30, 2003
Priority DateSep 30, 2003
Inventor/ApplicantsKurt George Steiner
Mark Adam Bachman
John William Osenbach
Daniel Patrick Chesire
Sailesh Mansinh Merchant
ExaminesNGUYEN, THINH T
Art Unit2818
Technology Center2800
Assignments
Bell Semiconductor Llc
Current
Bellnorthern Research
Current
Hilco Patent Acquisition 55 Llc
Current
Agere Systems BroadcomBroadcom
Original
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