Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect | Patent Number 06849946

US 06849946 B2
Application Number9779123
Publication NumberUS 20020106886 A1
Pendency3 years, 12 months
Filled DateFeb 7, 2001
Priority DateAug 31, 1998
Publication DateAug 8, 2002
Expiration DateAug 31, 2018
Inventor/ApplicantsChristopher A. Seams
Anantha R. Sethuraman
Anantha R. Sethuraman
Christopher A. Seams
ExaminesLEE, HSIEN MING
Art Unit2823
Technology Center2800
Assignments
Tessera Advanced Technologies Inc.
Current
Dts
Current
Ibiquity Digital Corporation
Current
Invensas Corporation
Current
Tessera Xperi
Current
Phorus Inc.
Current
Cypress SemiconductorInfineon Technologies Ag
Original
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