Package structure for a photosensitive chip | Patent Number 06590269
US 06590269 B1Filled DateApr 1, 2002
Priority DateApr 1, 2002
Publication Date-
Expiration DateApr 1, 2022
Inventor/ApplicantsMeng Ru Tsai
Fu Yung Huang
Chih Cheng Hsu
Yung Sheng Chiu
Jichen Wu
Jason Chuang
Hsiu Wen Tu
Mon Nan Ho
Jachson Hsieh
Allis Chen
Fu Yung Huang
Chih Cheng Hsu
Yung Sheng Chiu
Jichen Wu
Jason Chuang
Hsiu Wen Tu
Mon Nan Ho
Jachson Hsieh
Allis Chen
ExaminesCLARK, JASMINE JHIHAN B
Art Unit2815
Technology Center2800
Law Firm
You must be logged in to view
LoginAttorneys
Subscription-Only
View Concierge ProgramEmpower your practice with Patexia Publication Prosecution IP Module.
Get access to our exclusive rankings and unlock powerful data.
Looking for a Publication Attorney?
Get in touch with our team or create your account to start exploring a
network of over 120K attorneys.