Package structure for a photosensitive chip | Patent Application Number 10114201

10114201
Not Appealed
Patent NumberUS 06590269 B1
Publication Number-
Filled DateApr 1, 2002
Priority DateApr 1, 2002
Inventor/ApplicantsJachson Hsieh
Fu Yung Huang
Yung Sheng Chiu
Mon Nan Ho
Chih Cheng Hsu
Hsiu Wen Tu
Jason Chuang
Meng Ru Tsai
Jichen Wu
Allis Chen
ExaminesCLARK, JASMINE JHIHAN B
Art Unit2815
Technology Center2800
Assignments
Kt Imaging Usa Llc
Current
Kingpak Technology Inc.
Original
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