Elimination of residual materials in a multiple-layer interconnect structure | Patent Number 06153933

US 06153933 NA
Application Number8925821
Publication Number-
Pendency3 years, 2 months, 25 days
Filled DateSep 5, 1997
Priority DateSep 5, 1997
Publication Date-
Expiration DateSep 5, 2017
Inventor/Applicants Minh Van Ngo
Steven C. Avanzino
Darin A. Chan
Christy Mei-Chu Woo de la Girond'arc
Subramanian Venkatkrishnan
Diana M. Schonauer
ExaminesPOTTER, ROY KARL
Art Unit2822
Technology Center2800
Assignments
Lone Star Silicon Innovations Llc
Current
Advanced Micro Devices Inc
Original
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