Elimination of residual materials in a multiple-layer interconnect structure | Patent Application Number 8925821

8925821
Appealed
Patent NumberUS 06153933 NA
Publication Number-
Filled DateSep 5, 1997
Priority DateSep 5, 1997
Inventor/Applicants Diana M. Schonauer
Christy Mei-Chu Woo de la Girond'arc
Subramanian Venkatkrishnan
Steven C. Avanzino
Darin A. Chan
Minh Van Ngo
ExaminesPOTTER, ROY KARL
Art Unit2822
Technology Center2800
Assignments
Lone Star Silicon Innovations Llc
Current
Advanced Micro Devices Inc
Original
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