Panel for enhancing thermal conduction in an electronic assembly | Patent Application Number 13739995
13739995
Not Appealed
Inventor/ApplicantsRobert H. Smith
ExaminesSMITH, COURTNEY L
Art Unit2835
Technology Center2800
Law Firm
You must be logged in to view
LoginAttorneys
Subscription-Only
View Concierge ProgramEmpower your practice with Patexia Publication Prosecution IP Module.
Get access to our exclusive rankings and unlock powerful data.
Looking for a Publication Attorney?
Get in touch with our team or create your account to start exploring a
network of over 120K attorneys.