Panel for enhancing thermal conduction in an electronic assembly | Patent Number 09253925
US 09253925 B1Filled DateJan 11, 2013
Priority DateJan 11, 2013
Publication Date-
Expiration DateJan 10, 2033
Inventor/ApplicantsRobert H. Smith
ExaminesSMITH, COURTNEY L
Art Unit2835
Technology Center2800
Law Firm
You must be logged in to view
LoginAttorneys
Subscription-Only
View Concierge ProgramEmpower your practice with Patexia Publication Prosecution IP Module.
Get access to our exclusive rankings and unlock powerful data.
Looking for a Publication Attorney?
Get in touch with our team or create your account to start exploring a
network of over 120K attorneys.