Connection module and thinning method thereof | Patent Publication Number 20230246363

US 20230246363 A1

Patent NumberUS 11955743 B2

Application Number17589296

Filled DateJan 31, 2022

Priority DateJan 31, 2022

Publication DateAug 3, 2023

Original AssigneeGetac Technology Corporation

Current AssigneeGetac Technology Corporation

Inventor/ApplicantsWan-Lin Hsu
WAN-LIN HSU
Juei-Chi Chang
JUEI-CHI CHANG

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