Connection module and thinning method thereof | Patent Publication Number 20230246363

US 20230246363 A1
Patent NumberUS 11955743 B2
Application Number17589296
Filled DateJan 31, 2022
Priority DateJan 31, 2022
Publication DateAug 3, 2023
Inventor/ApplicantsWan-Lin Hsu
Juei-Chi Chang
JUEI-CHI CHANG
WAN-LIN HSU
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