Systems and methods for enhanced wafer manufacturing | Patent Publication Number 20220334568

US 20220334568 A1

Patent NumberUS 11846917 B2

Application Number17810976

Filled DateJul 6, 2022

Priority DateFeb 10, 2020

Publication DateOct 20, 2022

Original AssigneeGlobalwafers Co. Ltd.

Current AssigneeGlobalwafers Co. Ltd.

Inventor/ApplicantsSumeet S. Bhagavat

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