High-efficiency, large-area, topology-optimized metasurfaces | Patent Publication Number 20220214479

US 20220214479 A1

Patent NumberUS 11841518 B2

Application Number17606729

Filled DateApr 29, 2020

Priority DateApr 29, 2019

Publication DateJul 7, 2022

Original AssigneeStanford University

Current AssigneeStanford University

Inventor/ApplicantsJianji Yang
Jonathan A. Fan
David Sell
Thaibao Phan

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