Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions | Patent Publication Number 20180166552

US 20180166552 A1
Patent NumberUS 10090395 B2
Application Number15877837
Filled DateJan 23, 2018
Priority DateAug 12, 2002
Publication DateJun 14, 2018
Original AssigneeAcorn Technologies Inc.
Current AssigneeAcorn Technologies Inc.
Inventor/ApplicantsDaniel J. Connelly
Daniel E. Grupp
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