CHIP PACKAGE AND METHOD FOR FORMING THE SAME | Patent Publication Number 20170186712

US 20170186712 A1
Patent Number-
Application Number15393170
Filled DateDec 28, 2016
Priority DateDec 29, 2015
Publication DateJun 29, 2017
Original Assignee
Current AssigneeXintec Inc.
Inventor/ApplicantsAng CHAN
Po-Shen LIN
Chia-Lun SHEN
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