Protective tape and method for manufacturing a semiconductor device using the same | Patent Publication Number 20160181140
US 20160181140 A1Patent NumberUS 09741598 B2
Application Number14761913
Filled DateAug 18, 2014
Priority DateAug 18, 2014
Publication DateJun 23, 2016
Original AssigneeDexerials Corporation
Current AssigneeLintec Corporation
Inventor/ApplicantsShingo DEGUCHI
Hidekazu Yagi
Tomoyuki ISHIMATSU
Shingo Deguchi
Hidekazu YAGI
Tomoyuki Ishimatsu
Hironobu MORIYAMA
Hironobu Moriyama
Hidekazu Yagi
Tomoyuki ISHIMATSU
Shingo Deguchi
Hidekazu YAGI
Tomoyuki Ishimatsu
Hironobu MORIYAMA
Hironobu Moriyama
International
3
C09J
B32B
H01L
National
0
Field of Search
0
Patent Claims data is locked.
Login To View
Empower your practice with Patexia Publication Prosecution IP Module.
Get access to our exclusive rankings and unlock powerful data.
Looking for a Publication Attorney?
Get in touch with our team or create your account to start exploring a
network of over 120K attorneys.