Packaging structure of a semiconductor device | Patent Publication Number 20150021753

US 20150021753 A1
Patent NumberUS 09281265 B2
Application Number14488586
Filled DateSep 17, 2014
Priority DateMar 15, 2013
Publication DateJan 22, 2015
Inventor/ApplicantsJun Lu
Ping Huang
Yueh-Se Ho
Yan Xun Xue
Lei Shi
Liang Zhao
Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.