Semiconductor device, wiring board, and manufacturing method thereof | Patent Publication Number 20080001309

US 20080001309 A1
Patent NumberUS 07525189 B2
Application Number11569423
Filled DateMay 18, 2005
Priority DateMay 18, 2005
Publication DateJan 3, 2008
Original AssigneeAt&t Company
Current AssigneeGodo Kaisha Ip Bridge 1
Inventor/ApplicantsMasamoto Tago
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